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Part# Description Make Avail. Price Qty.  
286-CBT Aluminum and Copper Low-Cost Wave Solderable Heat Sink-TO-220 Case Style. Height Above PC Board in inches:1.19; Maximum Footprint in inches:1.000 x 0.500; Natural Convection:58 degree C at 4W; Forced Convection:7.4 degree C/W at 200 LFM. WAKEFIELD Available request quote request quote
287-1AB Wave Solderable Low-Cost Heat Sink-TO-220 Case Style. Type:Mounting Slot; Height Above PC Board in inches:1.8; Maximum Footprint "A" in inches:1.000 x 0.500 WAKEFIELD Available request quote request quote
287-1ABH Wave Solderable Low-Cost Heat Sink-TO-220 Case Style. Type:Mounting Hole; Height Above PC Board in inches:1.8; Maximum Footprint "A" in inches:1.000 x 0.500 WAKEFIELD Available request quote request quote
287-2AB Wave Solderable Low-Cost Heat Sink-TO-220 Case Style. Type:Mounting Slot; Height Above PC Board in inches:1.8; Maximum Footprint "A" in inches:1.000 x 1.000 WAKEFIELD Available request quote request quote
288-1AB Wave Solderable Low-Cost Heat Sink-TO-220 Case Style. Type:Mounting Hole; Height Above PC Board in inches:1.25; Maximum Footprint "A" in inches:1.000 x 1.000 WAKEFIELD Available request quote request quote
289-AB Low-Cost Single or Dual Package Heat Sink-TO-218, TO-202, TO-220 Case Styles; Height Above PC Board in inches:0.5; Horizontal Mounting Maximum Footprint in inches:1.000 x 0.710 WAKEFIELD Available request quote request quote
290-1AB Black Anodized Low-Cost Single or Dual Package Heat Sink-TO-218, TO-202, TO-220 Case Styles; Height Above PC Board in inches:0.5; Horizontal Mounting Maximum Footprint in inches:1.000 x 1.180 WAKEFIELD Available request quote request quote
290-2AB Low-Cost Single or Dual Package Heat Sink-TO-218, TO-202, TO-220 Case Styles; Height Above PC Board in inches:0.5; Horizontal Mounting Maximum Footprint in inches:1.000 x 1.180 WAKEFIELD Available request quote request quote
291-H36AB HEATSINK TO-220 CLIP-ON BLK WAKEFIELD Available request quote request quote
301M 301 Series Extruded Heat Sink, 2.5 /W at 250 ft/min Forced Convection, 70 at 15 W Thermal Resistan WAKEFIELD Available request quote request quote
301N Heat Sink WAKEFIELD Available request quote request quote
302M 302 Series Extruded Heat Sink, 1.8 /W at 250 ft/min Forced Convection, 50 at 15 W Thermal Resistan WAKEFIELD Available request quote request quote
302N Heat Sink WAKEFIELD Available request quote request quote
302NN Compact Heat Sink for Dual Stud-Mounted Semiconductor Case. Outline Dimensions in inches:2.000 x 2.000; Length in inches:1.5; Mounting Holes:(2) 1/4-28 UNF WAKEFIELD Available request quote request quote
303N Compact Heat Sink for Dual Stud-Mounted Semiconductor Case. Outline Dimensions in inches:2.000 x 2.000; Length in inches:3; Mounting Holes:(1) 1/4-28 UNF WAKEFIELD Available request quote request quote
303NN 303 Series Extruded Heat Sink, 1.3 /W at 250 ft/min Forced Convection, 37 at 15 W Thermal Resistan WAKEFIELD Available request quote request quote
330-SC SPEEDCLIP S/S FOR 667 SERIES WAKEFIELD Available request quote request quote
330SC FASTENERS, CLIP RoHS Compliant: Yes WAKEFIELD Available request quote request quote
392-120AB Heat Sink WAKEFIELD Available request quote request quote
392-180AB HEATSINK EXTRUSION IGBT/SSR BLK WAKEFIELD Available request quote request quote
392-180AB Heat Sink WAKEFIELD Available request quote request quote
392-300AB Black Anodize High Performance Heat Sink For Power Modules; Overall Dimensions (W x L x H) in inches:4.921 x 11.811 x 5.346 WAKEFIELD Available request quote request quote
392-300AB Heat Sink WAKEFIELD Available request quote request quote
394-1AB Heat Sink WAKEFIELD Available request quote request quote
394-2AB Heat Sink WAKEFIELD Available request quote request quote

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