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Part# Description Make Avail. Price Qty.  
2016 Wakefield 2016 72" Extrusion WAKEFIELD Available request quote request quote
205SB 205 Series Board Level Heat Sink WAKEFIELD Available request quote request quote
206-1PABH HEATSINK VERT ALUM BLK TO-220 WAKEFIELD Available request quote request quote
207AB High-Efficiency Heat Sink for Small Metal Can Power Semiconductors-Aluminum, Black Anodized. Type:Dual-Level Star; Heat Sink IDxODxH in inches:0.255 x 0.72 x 0.375; Applicable Case Types:TO-5, VTO-9, TO-11, TO-12, TO-26, TO-29, TO-33, TO-43, TO-45. WAKEFIELD Available request quote request quote
207SB High-Efficiency Heat Sink for Small Metal Can Power Semiconductors-Silver-Bearing Copper; Black Ebonol "C". Type:Dual-Level Star; Heat Sink IDxODxH in inches:0.255x0.72x0.375; Applicable Case Types:TO-5,VTO-9,TO-11,TO-12,TO-26,TO-29,TO-33,TO-43,TO-45. WAKEFIELD Available request quote request quote
217-36CT6 HEATSINK DPAK SMT TIN PLATED WAKEFIELD Available request quote request quote
217-36CTE6 HEATSINK DPAK SMT TIN PLATED WAKEFIELD Available request quote request quote
218-40CT3 HEATSINK ALUM BLACK SMD WAKEFIELD Available request quote request quote
218-40CT5 HEATSINK ALUM NATURAL SMD WAKEFIELD Available request quote request quote
230-75AB HEATSINK TO-220 VERT/HORZ BLK WAKEFIELD Available request quote request quote
231-69PAB-15V HEATSINK WAKEFIELD Available request quote request quote
233-60AB HEATSINK TO-220 VERT/HORZ BLK WAKEFIELD Available request quote request quote
233-60AB-10 233 Series Board Level Heat Sink WAKEFIELD Available request quote request quote
235-85AB HEATSINK TO-220 CLIP-ON BLK WAKEFIELD Available request quote request quote
236-150AB-05 Heat Sink WAKEFIELD Available request quote request quote
240-118ABH-22 HEATSINK TO-220 VERT TWIST FIN WAKEFIELD Available request quote request quote
243-3PAB HEATSINK TO-220 CLIP-ON BLK WAKEFIELD Available request quote request quote
258 Board Level Power Semiconductor Heat Sink; Thermal Links for Fused Glass Diodesl Dimensions (L x W x H) in inches:0.500 x 0.250 x 0.340 WAKEFIELD Available request quote request quote
260-4T5E Cup Clips For TO-5 Case Style Board Level Power Semiconductor Heat Sink. Insulation Type:Epoxy Insulated; Outline Dimension (L x W x I.D.) in inches:0.370 x 0.380 diameter x 0.290; Weight in pounds:0.0024 WAKEFIELD Available request quote request quote
260-4TH5E Cup Clips For TO-5 Case Style Board Level Power Semiconductor Heat Sink. Insulation Type:Epoxy Insulated; Outline Dimension (L x W x I.D.) in inches:0.400 x 0.370 hex x 0.290; Weight in pounds:0.0031 WAKEFIELD Available request quote request quote
260-6SH5E Cup Clips For TO-5 Case Style Board Level Power Semiconductor Heat Sink. Insulation Type:Epoxy Insulated; Outline Dimension (L x W x I.D.) in inches:0.557 x 0.370 hex x 0.290; Weight in pounds:0.0037 WAKEFIELD Available request quote request quote
262-75AB-01 HEATSINK VERT/HORIZ BLACK TO-220 WAKEFIELD Available request quote request quote
262-75AB-05 HEATSINK VERT/HORIZ BLACK TO-220 WAKEFIELD Available request quote request quote
265-118ABH-22 HEATSINK VERT ALUM BLACK TO-220 WAKEFIELD Available request quote request quote
270-AB Small Footprint Low-Cost Heat Sink-TO-220, TO-202 Case Styles; Height Above PC Board in inches:0.375. Horizontal Mounting Max. Footprint in inches:1.750 x 0.700; Natural Convection/Forced Convection:70 degree C at 4W/6.0 degrees; Weight in pounds:0.0052 WAKEFIELD Available request quote request quote

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