Black Anodized Omnidirectional Pin Fin Heat Sink for IntelDX4(TM), AMD Am29240(TM), PowerPC(TM) 603; Base Dimension in inches:1.100 square; Height in inches:0.6
Omnidirectional Pin Fin Heat Sink for IntelDX4(TM), AMD Am29240(TM), PowerPC(TM) 603 with specifies preapplied pressure sensitive Chrometic Inc. T-405 PSA adhesive. Base Dimension in inches:1.100 square; Height in inches:0.6
Omnidirectional Pin Fin Heat Sink for IntelDX4(TM), AMD Am29240(TM), PowerPC(TM) 603 with ARolad 8223 Thermally Conductive Bonding Tape. Base Dimension in inches:1.100 square; Height in inches:0.6
Omnidirectional Pin Fin Heat Sink for IntelDX4(TM), AMD Am29240(TM), PowerPC(TM) 603 with specifies Chromatic Inc. T-412 PSA adhesive. Base Dimension in inches:1.100 square; Height in inches:0.6
Labor-Saving SpeedClip(TM) Heat Sink for Vertical Board Mounting-TO-220 Case Style with wavesolderable plain pins. Maximum Footprint in inches:1.375 x 0.500; Height Above PC Board in inches:1
Labor-Saving SpeedClip(TM) Heat Sink for Vertical Board Mounting-TO-220 Case Style with wavesolderable hex-shaped standoff pins. Maximum Footprint in inches:1.375 x 0.500; Height Above PC Board in inches:1
Labor-Saving SpeedClip(TM) Heat Sink for Vertical Board Mounting-TO-220 Case Style; Maximum Footprint in inches:1.375 x 0.500; Height Above PC Board in inches:1.5
Maximum Efficiency Omnidirectional Heat Sink-TO-3, TO-220 Case Styles. Horizontal Mounting Footprint Dimensions in inches:1.810 square; Height Above PC Board in inches:1; Semiconductor Mounting Hole Pattern:TO-3