Pin Fin Heat Sink for IntelDX4(TM), Intel 80486DX2(TM), and Am486(TM) DX2, Am486(TM) DX4 with ARolad 8223 Thermally Conductive Bonding Tape. Base Dimension in inches:1.750 x 1.700; Height in inches:0.4
Pin Fin Heat Sink for IntelDX4(TM), Intel 80486DX2(TM), and Am486(TM) DX2, Am486(TM) DX4 with specifies Chromatic Inc. T-412 PSA adhesive. Base Dimension in inches:1.750 x 1.700; Height in inches:0.4
Pin Fin Heat Sink for IntelDX4(TM), Intel 80486DX2(TM), and Am486(TM) DX2, Am486(TM) DX4; Base Dimension in inches:1.750 x 1.700; Height in inches:0.65
Pin Fin Heat Sink for IntelDX4(TM), Intel 80486DX2(TM), and Am486(TM) DX2, Am486(TM) DX4 with specifies preapplied pressure sensitive Chrometic Inc. T-405 PSA adhesive. Base Dimension in inches:1.750 x 1.700; Height in inches:0.65
Maximum Performance Natural Convection Heat Sink for all Metal-Case Semiconductors-TO-3 Case Style. Outline Dimensions in inches:4.125 x 3.000; Mounting Hole Pattern:(1) TO-3