Top-Mount Booster Heat Sink-TO-220 Case Style; Height Above Semiconductor Case in inches:0.5. Horizontal Mounting Max. Footprint in inches:1.75 x 0.700; Natural Convection:62 degree C at 4W; Forced Convection:5.1 degree C/W at 400 LFM.
Small Footprint Low-Cost Heat Sink-TO-220, TO-202 Case Styles; Height Above PC Board in inches:0.375. Horizontal Mounting Max. Footprint in inches:1.750 x 1.450; Natural Convection/Forced Convection:42 degree C at 4W/3.6 degrees; Weight in pounds:0.0105
Low-Cost, Low Height Heat Sink-TO-218, TO-220 Case Styles. Height Above PC Board in inches:0.375; Horizontal Mounting Maximum Footprint in inches:0.750 x 0.750; Natural Convection:49 degree C at 2W; Forced Convection:7.2 degree C/W at 400 LFM.
Low-Cost, Low Height Heat Sink-TO-202, TO-220 Case Styles. Height Above PC Board in inches:0.375; Horizontal Mounting Maximum Footprint in inches:0.520 x 0.750; Natural Convection:56 degree C at 2W; Forced Convection:8.0 degree C/W at 400 LFM.
Low-Cost, Low Height Heat Sink-TO-202, TO-220 Case Styles. Height Above PC Board in inches:0.5; Horizontal Mounting Maximum Footprint in inches:0.520 x 0.750; Natural Convection:50 degree C at 2W; Forced Convection:7.0 degree C/W at 400 LFM.
Low-Cost, Low Height Heat Sink-TO-202, TO-220 Case Styles. Height Above PC Board in inches:0.25; Horizontal Mounting Maximum Footprint in inches:0.520 x 0.750; Natural Convection:62 degree C at 2W; Forced Convection:9.0 degree C/W at 400 LFM.
SpeedClips(TM) for 667 Series Heat Sink for use with 667 Series employ a locking safety tab for mounting. Nominal installed loading force 10 lbs. Material: stainless steel.
Aluminum and Copper Low-Cost Wave Solderable Heat Sink-TO-220 Case Style. Height Above PC Board:1.19 inches; Maximum Footprint:1.000 x 0.500 inches; Natural Convection:58 degrees C at 4W; Forced Convection:7.4 degrees C/W at 200 LFM.
Aluminum and Copper Low-Cost Wave Solderable Heat Sink-TO-220 Case Style. Height Above PC Board in inches:1.19; Maximum Footprint in inches:1.000 x 0.500; Natural Convection:58 degree C at 4W; Forced Convection:7.4 degree C/W at 200 LFM.
Wave Solderable Low-Cost Heat Sink-TO-220 Case Style. Type:Mounting Slot; Height Above PC Board in inches:1.8; Maximum Footprint "A" in inches:1.000 x 0.500
Wave Solderable Low-Cost Heat Sink-TO-220 Case Style. Type:Mounting Hole; Height Above PC Board in inches:1.8; Maximum Footprint "A" in inches:1.000 x 0.500
Wave Solderable Low-Cost Heat Sink-TO-220 Case Style. Type:Mounting Slot; Height Above PC Board in inches:1.8; Maximum Footprint "A" in inches:1.000 x 1.000
Wave Solderable Low-Cost Heat Sink-TO-220 Case Style. Type:Mounting Hole; Height Above PC Board in inches:1.25; Maximum Footprint "A" in inches:1.000 x 1.000
Low-Cost Single or Dual Package Heat Sink-TO-218, TO-202, TO-220 Case Styles; Height Above PC Board in inches:0.5; Horizontal Mounting Maximum Footprint in inches:1.000 x 0.710
Black Anodized Low-Cost Single or Dual Package Heat Sink-TO-218, TO-202, TO-220 Case Styles; Height Above PC Board in inches:0.5; Horizontal Mounting Maximum Footprint in inches:1.000 x 1.180
Low-Cost Single or Dual Package Heat Sink-TO-218, TO-202, TO-220 Case Styles; Height Above PC Board in inches:0.5; Horizontal Mounting Maximum Footprint in inches:1.000 x 1.180